Disk drive having magnetic head conduction paths with arrangements to control impedance

ABSTRACT

Magnetic disk apparatus includes an electric wiring capable of satisfying an electric condition under which high frequency recording higher than or equal to 200 MHz, a magnetic head having at least a recording device to a magnetic recording medium, and also the electric wiring corresponding to a recording current supplying device to this magnetic head are formed on a suspension member for mechanically suspending the magnetic head, the recording current being supplied to a magnetic head recording device by employing such electric wiring, the characteristic impedance of which is higher than a maximum impedance of the magnetic head recording device.

This is a continuation application of U.S. Ser. No. 10/318,114, filedDec. 13, 2002 now U.S. Pat No. 6,661,613; which is a continuationapplication of U.S. Ser. No. 10/126,576, filed Apr. 22, 2002, now U.S.Pat. No. 6,529,348; which is a continuation application of U.S. Ser. No.09/523,383, filed Mar. 10, 2000, now U.S. Pat. No. 6,404,594.

BACKGROUND OF THE INVENTION

The present invention generally relates to a magnetic disk apparatusemployed in a computer, an information processing apparatus, and so on.More specifically, the present invention is directed to a structure of amagnetic disk apparatus with employment of an electric wiring capable ofsatisfying an electric condition under which high frequency recordinghigher than or equal to 200 MHz can be realized in this magnetic diskapparatus.

As storage apparatuses of information processing appliances,semiconductor memories and magnetic member memories are mainly employed.In view of access time, semiconductor memories are employed as internalstorage apparatuses, whereas in view of large memory capacities andnon-volatile characteristics, magnetic member memories are employed asexternal storage apparatuses. Nowadays, magnetic disks and magnetictapes are major materials of such magnetic member memories. As recordingmedia employed in these magnetic disks/tapes, magnetic thin films areformed on either substrates or tapes. Magnetic head recording (writing)elements having electromagnetic converting effects are used so as towrite magnetic information on these recording media. Also, to reproduce(read) magnetic information, magnetic head reproducing elements areemployed which may utiliz the magneto resistive phenomenon, the giantmagnetoresistive phenomenon, or the electromagnetic inductancephenomenon. These functional element units are provided on input/outputparts called as magnetic heads.

Among these magnetic recording apparatuses, the present inventionrelates to a structure of a high frequency recording magnetic diskapparatus. More specifically, the present invention directs to anelectric wiring itself of a magnetic head, and also a structure of amagnetic disk apparatus arranged by containing this electric circuit,and a magnetic head recording element unit, by which high frequencyrecording operation can be realized.

As to a major trend in high-performance magnetic recording aspects,these are one trend of a high recording density technique, and alsoanother trend of a high frequency technique. This high recording densitytechnique is described in, for example, Japanese magazine NIKKEIELECTRONICS titled “Recording density by MR head available at 5 Gbits/(inch)²” issued on Apr. 6, 1998, pages 155 to 165. On the otherhand, the high frequency technique is described in, for example,Japanese Electronic Information Communication Institute TechnicalResearch Report “JIKI KIROKU” published on Oct. 15, 1998, pages 7 to 12.It should be understood that the present invention is directed to anovel technique as to the latter-mentioned high frequency technique.

In the conventional magnetic storage apparatuses, frequencies usedduring recording operations and reproducing operations never exceed 100MHz. However, in future, in high density magnetic recording apparatuses,data transfer performance achieved in these high density magneticrecording apparatuses must be increased higher than or equal to 50 MB/S,since a large amount of data should be input/output within a short timeperiod. This data transfer performance of 50 MB/S defined in such amagnetic recording apparatus implies that a frequency range is increasedhigher than or equal to 200 MHz (50×8/2 Hz).

Within such a range that a recording frequency does not exceed 100 MHz,a twisted line is employed so as to electrically couple a magnetic headto an IC for controlling recording/reproducing operation. However, thetwisted line owns such a problem that since this twisted line owns alarge inductance component, a high frequency signal required forperforming a high-speed recording operation can be hardly transmitted.

To solve this problem, for example, the suspension referred to as a“line-integral type suspension” is employed. This suspension isdescribed in Japanese magazine NIKKEI ELECTRONICS issued on Apr. 6,1998, page 168. In this suspension, the wiring lines used to supply thesignals and the electric power are directly formed on the suspension.Since this suspension member is formed by way of the photo-etchingmanner, both the width between the wiring lines and the interval betweentwo wiring lines can be made shorter than or equal to 30 μm. As aresult, the inductances of the wiring lines can be suppressed smallerthan or equal to 50 nH. Because of this effect, the recording operationhigher than or equal to 200 MHz may be realized in the magneticrecording apparatus with employment of the line-integral type suspensionstructure.

However, the wiring line is actually formed and is actually coupled tothis wiring line. It could be revealed that a desirable high frequencyrecording operation could not be carried out in this actual case. Thisreason may be caused by the wavelengths of the high frequency componentscontained in the recording current. Therefore, in order to solve thisproblem, it is conceivable that the length of the electric wiring linshould be shortened.

FIG. 1 shows such an example of an improvement in the line-integral typesuspension so as to solve the above-described problem. The read/writeIC2 is provided on the suspension 3 in such a way that this read/writeIC2 is approached to the magnetic head 1. In this drawing, referencenumeral 4 is an electric wiring for supplying a signal and electricpower, reference numeral 5 denotes an arm, and reference numeral 6indicates a boss used to mount the arm. This conventional technique isreferred to as a “Chip on Suspension”, which is reported from, forexample, Japanese Applied Magnetic Institute, 22nd Lecture held in 1998.

The technique for providing the read/write IC on the suspension locatednear the magnetic head so as to shorten the length of the electricwiring may be obvious from the above-described technical documents. Whenthe read/write IC is mounted on such a member having a poor heatradiation characteristic, extension and/or distortion may occur due toheat, which may cause the performance of the magnetic disk apparatus tobe deteriorated. Furthermore, there is another problem that mass isincreased and a total number of electric wirings is increased, since theread/write IC is mounted on the mechanical movable unit. To solve theseproblems, newly considered solutions are necessarily required, but thesesolutions could increase the cost up aspect of the magnetic diskapparatus.

Also, one technical idea capable of uniforming impedances oftransmission paths has been proposed in PCT Laid-open Publication No.WO96/42080. Even when such a proposed technical idea is employed, it ispractically difficult to realize the high frequency recording operation.This technical propose may prevent the reflections occurred in thesignal lines by uniforming the impedances of the transmission path,namely smoothing the impedance changes.

However, even when no reflection condition is made in the electricwiring by applying the above-explained technical method, if theimpedance of the magnetic head cannot be matched with the impedancebetween the electric wiring, then the maximum reflection may occur atthis mismatching portion, so that the electric length cannot be madelong.

SUMMARY OF THE INVENTION

The performance of a storage apparatus may b determined by speeds duringinput/output operations and also by a storage capacity. In order toimprove product competitiveness, access time should be shortened and astorage capacity should be increased. In order to satisfy thisrequirement, in general, the line-integral type suspension in which thewiring line is directly formed on the suspension is utilized.

However, as previously explained, even when the electric wiring ismerely formed on the suspension, it can be apparent that this structureis not suitable for the high frequency recording operation.

An object of the present invention is to provide a magnetic diskapparatus capable of realizing a high frequency recording operationoperable higher than or equal to 200 MHz without increasing a cost-upaspect, while disclosing a novel structure of an electric wiring for amagnetic disk, and also a novel construction of a magnetic headrecording unit.

BRIEF DESCRIPTION OF THE DRAWINGS

A more better understanding of the present invention may be made byreading a detailed description in conjunction with the accompanyingdrawings, in which:

FIG. 1 is a conceptional drawing for illustratively representing theconventional suspension member;

FIG. 2A is a conceptional diagram for illustratively showing a majorportion of an insulating type suspension capable of realizing thepresent invention;

FIG. 2B is a sectional view indicated by the arrows IIB—IIB on FIG. 2A;

FIG. 3A is a first conceptional diagram for illustratively indicating amagnetic recording apparatus according to the present invention;

FIG. 3B is a sectional view indicated by the arrows IIIB—IIIB on FIG.3A;

FIG. 4 is a graphic representation for representing a basic measurementresult of the present invention;

FIG. 5 is a graphic representation for representing a measurement resultof rise time “τ” of a recording current;

FIG. 6 is a second conceptional diagram for illustratively showing amagnetic recording apparatus according to the present invention;

FIG. 7 is a conceptional diagram for illustratively indicating amagnetic head element;

FIG. 8A is a conceptional diagram for illustratively representingindicated by a circle on FIG. 8A showing major portion of insulatingtype suspension;

FIG. 8B is an enlarged view a pair of read wirings, capable of realizingthe present invention;

FIG. 8C is a sectional view indicated by the arrows VIIIC—VIIIC on FIG.8B;

FIGS. 9A, 9B, 9C are conceptional drawings for illustratively indicatingarrangements of write wiring pair and read wiring pair, capable ofrealizing the present invention; and

FIG. 10 is a graphic representation for representing a calculationresult used to calculate a change in the rise time “τ”.

DESCRIPTION OF THE EMBODIMENTS

The present invention will now be described in detail with reference tovarious preferred embodiments thereof.

Referring now to FIG. 2 and FIG. 3, a first embodiment of the presentinvention will be explained. FIG. 3 is a conceptional diagram forillustratively indicating a write unit of a magnetic disk apparatus forembodying the present invention. The write unit shown in FIG. 2 isconstituted by a magnetic head 1, suspension 3, an arm 5, and anelectric wiring 4. The magnetic head 1 converts electric informationinto magnetic information, and furthermore, realizes a read operation.The suspension 3 mechanically suspends the magnetic head, and producesdepressing weight against a magnetic recording medium. The arm 5supports this suspension 3. The electric wiring 4 functions as anelectric signal transferring unit to the magnetic head. The electricwiring 4 is connected to a read/write IC for inputting/outputting anelectric signal and for executing a signal process operation. Thisread/write IC is identical an IC2 shown in FIG. 3, and will be simplyreferred to as an “R/W IC” hereinafter.

As indicated in FIG. 3, various setting positions for an R/W IC2 may beconceived. That is, this R/W IC2 may be positioned on a circuit boardwhich is fixed on a housing of a magnetic disk apparatus, on a rotaryactuator, or on an arm. The present invention is not limited only tothese setting positions except for a specific case. In FIG. 3, referencenumeral 11 shows magnetic recording media, reference numeral 9 indicatesa rotary actuator, reference numeral 4 represents an electric wiring,reference numeral 5 indicates an arm, reference numeral 3 denotessuspension, and reference numeral 8 shows a case.

As indicated in FIG. 2A, the electric wiring 4 is formed on thesuspension 3. The electric wiring 4 is made of an electric-conductivemetal, and is protected by employing an insulating film in order tomaintain an electric-insulating condition with respect to the suspensionand other metal parts.

This structure is indicated in FIG. 2B. That is, FIG. 2B is a sectionalview for indicating this structure, taken along a line IIB—IIB of FIG.2A. The suspension 3 is manufactured by employing stainless steel havinga thickness of 25 μm. Then, polyimide resin 7-1 having a thickness of 20μm, which will constitute an insulating film, is covered on thisstainless steel, and the electric wiring 4 is formed thereon. A width ofeach of these electric wirings 4-1, 4-2, 4-3, and 4-4 is selected to be5.4 μm, and a thickness of each of these electric wirings is selected tobe also 5.4 μm. A film structure of the electric wiring 4 isAu/Ni/Cu/Cr.

To electrically and mechanically protect these electric wirings,polyimide resin 7-2 having a thickness of 10 μm is finally stacked. Therelative dielectric constant of the above-employed polyimide resin isequal to approximately 3.3.

FIG. 4 graphically shows a measurement result in such a case that acharacteristic impedance of an electric wiring path having theabove-explained structur is measured. This measurement result shown inFIG. 4 indicates a characteristic impedance of an electric wiring pathwhen the film thickness of the polyimide resin 7-1 shown in FIG. 2 isselected to be 10 μm in combination with another characteristicimpedance of another electric wiring path when the film thickness of thepolyimide resin 7-1 is selected to be 2 μm. As apparent from any ofthese measurement results, there is such a trend that the characteristicimpedance is decreased in connection with an increase of a frequency.While the frequency is fixed to 1 GHz, when the measured values of thecharacteristic impedances are compared with each other, the followingimpedance values are obtained. When the film thickness of the polyimideresin is selected to be 20 μm, the characteristic impedance becomes 150ohms. When this film thickness of the polyimide resin is decreased to 10μm, the characteristic impedance becomes 100 ohms. When the filmthickness of the polyimide resin is further decreased to 2 μm, thecharacteristic impedance becomes 50 ohms. As apparent from the foregoingdescription, the characteristic impedance of the electric wiring path islowered, while the film thickness of the polyimide resin is decreased.

Next, these measurement results are compared with a change in impedancesof a magnetic head used in this embodiment. In FIG. 4, this change inthe impedances of the magnetic head is jointly indicated. As apparentfrom this graphic representation, the impedance of the magnetic headbecomes maximum, namely 100 ohms near the frequency of 1 GHz, and thehigher the frequency is increased, the smaller the impedance of themagnetic head is decreased.

When this change is compared with the change in the characteristicimpedance of the electric wiring path, in such a case that the filmthickness of the polyimide resin is selected to be 20 μm, thecharacteristic impedance of the electric wiring path exceed theimpedance of the magnetic head under all frequency conditions. However,when the film thickness of the polyimide resin is selected to be 10 μm,the frequencies where the characteristic impedance of the electricwiring path exceed the impedance of the magnetic head are limited loweror equal to than approximately 1 GHz at which the impedance of themagnetic head becomes maximum. Furthermore, when the film thickness ofthe polyimide resin is selected to be 2 μm, the frequencies where thecharacteristic impedance of the electric wiring path exceeds theimpedance of the magnetic head are limited lower or equal to thanapproximately 600 MHz, namely the low frequency condition.

In order to further investigate a relationship between thecharacteristic impedance owned by the above-explained electric wiringpath and the impedance of the magnetic head recording element portion,rise time of a current was measured by connecting the magnetic head toeach of the electric wirings.

FIG. 5 graphically represents a measurement result of rise time “τ” ofthis recording current. This rise time “τ” corresponds to time duringwhich an amplitude of this current is reached from 10% up to 90%. Whilethe lengths of the respective electric wirings are varied, changes inthe rise time “τ” are measured with respect to the changes in theselengths. While the R/W IC is connected to the input side of each of theelectric wirings, the rise time “τ” is measured at the current inputterminal of the magnetic head. For example, the following confirmationcould be made. That is, a current pulse of rise time “τ” nearly equal to0.5 ns (namely, rise time “τ” at output terminal) is outputted from theR/W IC employed in this rise time measurement.

When the measurement results shown in FIG. 5 are studied, the followingfact can be seen. When the film thickness of the polyimide resin is 20μm, namely when the characteristic impedance of the electric wiring pathexceeds the impedance of the magnetic head recording element portionunder all of the frequency conditions (condition 1), even if the lengthof the electric wiring path is made long, then the rise time “τ” of thecurrent pulse which is entered into the magnetic head recording elementportion is substantially equal to 1.5 ns, namely there is a smallinfluence. Also, when the film thickness of the polyimide resin is 10μm, namely when the characteristic impedance of the electric wiring pathis smaller than the maximum impedance of the magnetic head recordingelement portion (condition 2), the rise time “τ” is kept withinapproximately 2.0 ns. However, it can be seen that the change in theimpedance is slightly large, as compared with that of the condition 1.

On the other hand, when the film thickness of the polyimide resin is 2μm, namely in such a case that the characteristic impedance of theelectric wiring path exceeds the impedance of the magnetic headrecording element portion only in the low frequencies lower or equal tothan the frequency 600 MHz (condition 3), the rise time “τ” is extremelyincreased in connection with the increase of the electric wiring length,and is rapidly deteriorated.

As can be readily understood from the above-explained measurementresult, the smaller the value of the characteristic impedance becomes,and also the longer the length of the electric wiring path becomes, therise time “τ” is prolonged. This trend may occur, while a loss appearsin the electric wiring path. However, it can be seen that there is avery small change in the rise time “τ” under either the condition 1 orthe condition 2, as compared with that of the condition 3. As aconsequence, this phenomenon may be conceived that the problem caused bythe loss in the electric wiring path can be avoided by other factors.The reason why such a phenomenon occurs may be understood as follows:

That is, the magnetic recording unit of the magnetic head is constructedof a coil. Therefore, this magnetic recording unit may electricallyconstitute an inductive load. As a result, it is conceivable that theimpedance of the recording element unit of the magnetic head isuniformly increased in combination with increasing of the frequency.However, since the magnetic film of the actual magnetic head owns thefrequency characteristic and induces the magnetic field produced fromthe coil, there is such a trend that the impedance is decreased underhigh frequency condition. The frequency characteristic of this magneticfilm is caused by such that the permeability of the magnetic film forconstituting the magnetic head is varied in response to the frequency,and caused by the adverse influence of the eddy current flowing throughthis magnetic film. As a consequence, the impedance of the magnetic headowns the maximum impedance value.

It is practically difficult that the magnetic head with such animpedance change is electrically matched with the electric wirings withthe different characteristic impedance changes. As a result, reflectionsmay occur at mismatching portions, which may produce waveformdistortions. Also, this waveform distortion becomes conspicuous, becausethe longer the length of the electric wiring path is made, the largerthe phase sift of the high frequency component is increased.

Such a fact that the rise time “τ” is shortened, namely the signal hasthe same waveform when being outputted from the R/W IC implies that thewaveform distortion is avoided. It can be concluded that the reflectionsshould be avoided in order to reduce the waveform distortion.

Such a fact that the characteristic impedance of the electric wiring isincreased by the maximum impedance of the magnetic head, implies such afact that the characteristic impedance of the electric wiring path isincreased by the impedance of the magnetic head under all of thefrequency conditions. This implies such a phenomenon that the magnetichead can be hardly seen as the electric load from the side of the R/WIC. As a consequence, the following fact may be conceived. That is, theadverse influence caused by the mismatching phenomenon occurred at theconnection point between the electric wiring and the magnetic headrecording element portion can hardly appear. As a result of this effect,the margin of the rise time “τ” with respect to the electric wiring pathlength is increased.

It should be readily understood that the rise time “τ” corresponds to avery important parameter required when the magnetic head is switched ina high speed switching operation, and this rise time “τ” should belocated within a recording time period for 1-bit information.

Under such recording frequencies higher than or equal to 200 MHzdirected to the present invention, the recording magnetic field must beswitched with 2.5 ns. In the case of the magnetic head recording elementunit as explained in this embodiment, the rise time “τ” is required tobe set within approximately 1 ns, while considering a time delay definedafter the input of the current up to the generation of the magneticfield. Generally speaking, a time delay defined after an input of acurrent up to a generation of a magnetic field may depend upon astructure of a magnetic head, and an amplitude of a current.

When the measurement result shown in FIG. 5 is investigated, under sucha condition (namely, condition 1) that the characteristic impedance ofthe electric wiring path exceeds the impedance of the magnetic headrecording element unit under all of the frequency conditions, even whensuch an electric wiring path having a length of approximately 80 mm isemployed, it can be seen that this purpose can be satisfied. Also, thefollowing facts may be revealed. That is, under such a condition(condition 2) that the characteristic impedance of the electric wiringpath cannot be made equal to the maximum impedance of the magnetic headrecording element unit, the length of the electric wiring path islimited within 50 mm. Furthermore, under such a condition (condition 3)that the characteristic impedance of the electric wiring path becomessmaller than the impedance of the magnetic head recording element unit,the length of the electric wiring path is limited within 20 mm.

It may be easily understood that the longer the distance between themagnetic head and the R/W IC can be made, the easier the R/W IC can bemounted. In other words, if the length of the electric wiring path canbe made long, then the R/W IC need not be approached to the arm and thesuspension (namely, movable portion), and further, the magnetic head. Asa result, it is possible to avoid such problems that heat is producedfrom the R/W IC when this R/W IC is positioned near the magnetic head,mass or the movable portion is increased, and a total number of electricwirings used to drive the R/W IC is increased. As a consequence, thehigh frequency recording performance can be achieved from this effect,while maintaining both the productivity and the apparatus cost.

As apparent from the above-explained measurement result, theabove-explained feature owned by the electric wiring path having thehigher characteristic impedance (disclosed in the present invention) maydepend upon such a relationship between this characteristic impedance ofthe electric circuit path and the impedance of the magnetic headrecording element unit. This may be understood as such an effectachieved by making the characteristic impedance of the electric circuitpath higher than the impedance of the magnetic head recording elementportion. It should also be noted that in the above-explained embodiment,this relationship is defined within all of the frequency ranges. Evenwhen this relationship is limited to a narrower frequency condition soas to realize the present invention, a substantially same effect couldbe achieved. This example will now be described as a second embodiment.

The second embodiment is directed to a higher harmonic componentcontained in a recording current. In general, a recording current is arectangular pulse having a trapezoidal shape, and this rectangular pulsecontains high frequency components. Generally speaking, a frequencycomponent used to define rise time “τ” among these high frequencycomponents may be obtained from 0.35/τ. However, the following factcould be recognized from this second embodiment. That is, when a precisecalculation is carried out, there are large numbers of errors. In orderto represent “rise time τ being nearly equal to 1 ns” is precisionshorter than, or equal to ±0.1 ns, a higher frequency component of 1/τmust be considered. This rise time “τ” is required so as to realize highfrequency recording of 20 MHz.

FIG. 10 graphically shows an example of a calculation executed in orderto acquire an influence degree of the above-explained higher harmoniccomponent. This calculation method is carried out as follows. That is,after a trapezoidal pulse having rise time of 0.8 nsec isFourier-transformed so as to extract a frequency component contained inthis trapezoidal pulse, and components higher than or equal to anarbitrary frequency are intentionally deleted from the extractedfrequency component, namely the higher harmonic component is cut.Thereafter, the remaining pulse component is inverse-Fourier-transformedto thereby acquire a change in rise time.

An abscissa of this figure indicates a lower limit value of the cuthigher harmonic component in the unit of MHz, and an ordinate thereofshows rise time of the inverse-Fourier-transformed pulse waveform in theunit of nanosecond (nsec). There are two different definitions as torise time “τir”, namely a time period defined from 10% to 90%, andanother time period defined from 5% to 95%. These two differentdefinitions are described in FIG. 10.

When the measurement result is investigated, it can be seen that thehigher the frequency is cut, the smaller both the rise time “τir 5-95%”and the rise time “τir 10-90%” are decreased, while reducing thedeterioration of the waveforms. In particular, when the frequencieshigher than, or equal to 1,250 MHz are cut, there is a saturation trendin a change in the rise time “τir”. Also, the frequencies higher than orequal to this specific frequency do not constitute important factorsused to save the rise time “τsir” of the original waveform. Thisspecific frequency of 1,250 MHz is such a frequency calculated from aninverse number of the rise time of the trapezoidal pulse, namely 1/0.8nsec. In other words, the deformation of the original waveform may besuppressed by such a manner that the frequency components may passtherethrough, in which the frequency calculated from the inverse numberof the rise time is selected to be the upper limit frequency.

When the frequency component calculated from the conventional idea of0.35/τ is applied to this calculation example, an upper limit value of aconceivable frequency becomes 437 MHz. This frequency value is locatedoutside a left frame of FIG. 10 and when the calculation result isexternally interposed, it can be seen that a difference between thewaveform and the original waveform is considerably extended.

In order that the high frequency recording higher than, or equal to 200MHz can be achieved from this calculation result, in such a case thatthe rise time “τ” is required to be set within 1 ns, the high frequencycomponents higher than, or equal to 1 GHz must be considered. As aresult, in this second embodiment, the characteristic impedance of theelectric wiring path is made larger than the impedance of the magnetichead under all of the frequency conditions higher than or equal to 1GHz.

In this second embodiment, as to the rise time “τ”, the similar resultof that of the above-explained first embodiment could be similarlyachieved. The effects confirmed in this second embodiment could befirstly revealed in accordance with the present invention. This effectis given as follows: In the case that the electric wiring having thehigh characteristic impedance is employed, the deterioration of the risetime “τ” is reduced also when the length of the electric wiring path isprolonged, as compared with such a case that the electric wiring havingthe low characteristic impedance is employed. Based upon this effect,even under such a condition that the R/W IC is located apart from themagnetic head recording element unit, the high frequency recordingoperation, namely the high-speed recording operation can be achieved.There is a great merit in view of the productivity technical aspect.

Similar to the second embodiment, a third embodiment is featured by thatthe present invention is applied to a specific frequency condition. Aspreviously explained, such a frequency component that the frequencyindicated by 1/τ is set as the upper limit frequency may give theinfluence to the rise time “τ” among the higher harmonic frequencycomponents contained in the recording current. As a consequence, inaccordance with this third embodiment, in order to reduce a change inrise time “τ”, while such a frequency of “1/τ” is considered, arelationship between a characteristic impedance of an electric wiringpath and an impedance of a magnetic head recording unit is defined.Concretely speaking, the characteristic impedance of the electric wiringpath can become higher than the impedance of the magnetic head at such afrequency of 1,250 MHz (namely, 1/τir) in order that τir=0.8 nsec can berealized. In comparison with the second embodiment, there is only such adifference that the relationship between these characteristic impedanceand impedance is restricted to a specific frequency condition.

Also, in this third embodiment, there is a similar effect to that of theabove-explained second embodiment. Namely, the length of the electricwiring could be made long. As a specific feature, since the frequency isspecified as “1/τ”, there is such a merit that fluctuations among suchmagnetic heads having the same impedances can be reduced. In this case,the fluctuation implies a fluctuation in voltages appearing across inputterminals of a magnetic head, and also a fluctuation in rise time “τ”.

In the above-explained third embodiment, the magnetic head recordingelement unit is employed, the inductance of which is lower than or equalto 40 nH. This condition is caused by such a fact that thecharacteristic impedance of the electric wiring path is limited. Thecharacteristic of the electric wiring path may be calculated from(inductance per unit length/capacitance per unit length) ^(1/2),assuming now that the electric wiring path is approximated to no loss.In order to increase the characteristic impedance, this inductance perunit length may be increased whereas the capacitance per unit length maybe decreased. As is known, the inductance may be increased by wideningthe interval between the electric wiring paths. In order to reduce thecapacitance, the width of the electric wiring path must be madenarrower, or the material having the lower dielectric constant must beemployed in the insulating layer. An allowable range is apparentlydetermined when the interval between the electric wiring paths iswidened, due to such a geometrical dimensional relationship among aplurality of suspension for constituting this interval.

On the other hand, as to the measure for narrowing the width of theelectric wiring path so as to reduce the capacitance, an allowable rangeis apparently defined due to the following necessities. That is, acurrent on the order of several tens mA must be supplied in order todrive the magnetic head (in order to produce a magnetic field by amagnetic head having a low inductance). Also, in order to lower therelative dielectric constant of the dielectric member, an availablerange thereof is defined in view of a physical characteristic of amaterial (assuming now that dielectric constant of even air is 1).

When the above-described conditions are considered, the adjustable rangeof the characteristic impedance is selected from approximately 50 ohmsto 150 ohms. Under such a condition of the electric wiring path, theusable impedance range of the magnetic head becomes smaller than orequal to approximately 40 nH (in this third embodiment, it becomesmaximum impedance value of 150 ohms).

In the magnetic disk apparatus according to th present invention, themaximum recording frequency is at least higher than or equal to 200 MHz.The reason is given as follows. That is, as is known in this field, theabove-explained reflection problem in the high frequencies may becomeconspicuous when a {fraction (1/10)}-length (or ⅛-length) of awavelength (propagation speed) of a frequency component underconsideration is made shorter than the electric wiring path length. At afrequency of 200 MHz, one time period becomes 5 ns. Within this timeperiod, a signal is propagated over a distance of approximately 75 mm ifsuch a stripe line having a dielectric constant of approximately 3.3 isemployed. At a frequency of 100 MHz, a signal is propagated over adistance of 150 mm. Since the length of the electric wiring path used inthe conventional magnetic disk apparatus is selected to be approximately85 mm to 150 mm, if the frequency becomes lower than, or equal to 100MHz, then there is no problem.

However, when the frequency is increased up to 200 MHz, the length ofthe electric wiring path is required to be shortened within 75 mm.However, when the electric wiring path condition disclosed in thepresent invention is satisfied, as indicated in FIG. 5, the signal canbe propagated through the electric wiring path having the length longerthan or equal to 75 mm even at the recording frequency of 200 MHz.Because of this effect, the R/W IC need not be mounted on the movableunit. As a result, the magnetic disk apparatus according to the presentinvention can employ a similar structure to that of the conventionalmagnetic disk apparatus, the low cost apparatus can be developed. Sincesuch a merit can be realized, it is possible to realize such a magneticdisk apparatus having a higher product competitiveness.

In the present invention, the subject characteristic impedance “Z₀” isgiven as follows:

 Z ₀≈(L ₀ /C ₀)^(0.5),

where symbols “L₀” and “C₀” may be determined based upon an inductanceper unit length, and a capacitance per unit length.

Since the electric wiring path of the magnetic disk apparatus is a roundpath, a capacitance appears between signal lines and the characteristicimpedance Z₀ does not become infinitive. As an electric wiring pathhaving a large characteristic value Z₀, a feeder line (distance betweensignal lines is approximately 1 cm) is known in this technical field.However, the characteristic impedance of this feeder line is equal toabout 300 ohms. If an electric wiring path having a characteristicimpedance larger than this 300 ohms is made, then this path must ownsuch a shape that a distance between round signal paths is extremelyseparated from each other. As a result, the upper limit value of thecharacteristic impedance as defined in the magnetic disk apparatusaccording to the present invention is nearly equal to 300 ohms, which isconceivable by any person who is skilled in the electric field.

Also, the upper limit value of the characteristic impedance isrestricted by a voltage of a power supply. The restriction will now beexplained in detail. A product between the inductance “L₀” used todetermine the characteristic impedance and the length “l” of thetransmission path is equal to all of inductanc amounts owned by theelectric wiring path. When this inductance amount is added by theinductance “Lh” of the magnetic head, an inductance amount of a load asviewed from the R/W IC for supplying the recording current may becalculated. Assuming now that a recording current of 200 MHz is suppliedfrom the R/W IC, the rise time of this recording current must be setwithin 1.25 ns at minimum time. Now, when the magnitude of the recordingcurrent is assumed as 40 mA, ideally speaking, the power supply voltage“E” of the R/IC must satisfy the following formula:E>(L ₀×1+Lh)×40×10⁻³/1.25×10⁻⁹

On the other hand, there is such a trend that a voltage of a powersupply is lowered in view of high-speed operation as well as low powerconsumption of an IC. Therefore, presently available ±5V to ±3V shouldbe employed as the power supply voltage. Considering this restriction,the inductance (L₀×1+Lh) never exceeds 200 nH.

Now when the inductance of the magnetic head is estimated as 40 nH, aninductance of an electric wiring path may be defined as approximately160 nH. To calculate the upper limit value of the characteristicimpedance from this inductance value, the following assumption should bemade with respect to a capacitance of an electric wiring path per unitlength and also a length of this electric wiring path. The capacitanceof the electric wiring path per unit length is restricted by a shape ofsuch an electric wiring path applicable to the above-explained magneticdisk apparatus, namely, limited to approximately 200 pF/m. Assuming nowthat the length of the electric wiring path is equal to 10 (5) cm, thecharacteristic impedance Z₀ may be calculated as approximately 89 (126)ohms by using the above-explained calculation formula.

These values become lower values than the upper limit value restrictedby the above-explained shape of the electric wiring. In any case, it canbe understood that the characteristic impedance owns the predeterminedupper limit value.

To furthermore clarify the features of the present invention, a fourthembodiment will now be explained.

In order to realize the high frequency recording operation, the highfrequency recording current is required to be supplied to the magnetichead. To realize this high frequency recording operation, one method hasbeen proposed. That is, the R/W IC is installed on the suspension so asto reduce the inductance of the electric wiring path. However, aspreviously explained, this method may cause the following problems. Thatis, the positional precision is deteriorated, since the heat amountproduced from the IC and the mass thereof are increased, andfurthermore, the head seek speed is lowered. Furthermore, there areother problems as to the manufacturing aspect, since the R/W IC ismounted on the suspension having low mechanical rigidness. That is, themanufacturing cost is increased, and the difficult quality control isrequired.

To the contrary, such a problem never occurs by employing a method formounting an R/W IC on a carriage as shown in FIG. 6. In other words,since the mass-increased portion of this carriage with employment of theR/W IC is located near the drive portion for producing torque, a smalladverse influence is given to the deterioration in the positionalprecision and also lowering of the head seek speed. Also, since thecarriage portion owns high mechanical rigidness, no specific care shouldbe taken to destroy while the magnetic head apparatus is manufactured.Because of these reasons, the manufacturing cost is not increased, butalso there is no problem related to the production such as difficultiesof quality controls.

Referring now to FIG. 6, a description will be made of an example of amagnetic head to which the present invention is embodied. This magnetichead apparatus contains magnetic recording media (magnetic recordingdisks) 11, and is equipped with a constructural member. Thisconstructural member is constructed by a magnetic head 1 forinputting/outputting magnetic information into/from the magneticrecording media, suspension 3 for suspending the magnetic head and forlocating this magnetic head opposite to the magnetic recording mediaunder predetermined weight condition, and the arm 5 for mechanicallysupporting the suspension. Furthermore, a mechanism unit is arranged bya carriage 12 for bundling a plurality of arms to hold these bundledarms, and a rotary actuator 9 for driving the carriage. As apparent fromthe foregoing description, the electric wiring path 4 which may give therestriction to the characteristic impedance value is mounted on both thesuspension 3 and the arm 5.

Since the R/W IC2 is installed on the carriage 12 and is located nearthe actuator 9 for producing torque even when the mass is increased bymounting this R/W IC2, there is a very small adverse influence given tothe deterioration of the positioning precision and also to lowering ofthe head seek speed.

The frequency of the signals supplied from the R/W IC2 to an electriccable 14 is lowered by employing the parallel mode means. The signals ofthe signal cable 14 are entered via connectors 15 and 16 into a circuitboard 17. An IC circuit 18 for processing the signals is mounted on thecircuit board 17, by which a similar electric signal processingoperation to that of the conventional IC circuit is carried out. Theabove-explained members are stored in a case 8.

In this fourth embodiment, a high frequency recording current may flowbetween the magnetic head 1 and the R/W IC2. Since the electric wiringpath between this magnetic head 1 and the R/W IC2 owns thecharacteristic impedance as explained in the present invention, theelectric length of this electric wiring path which is restricted by thepropagation speed can be made longer. Because this effect can beachieved, the R/W IC can be set to such a position by which variousproblems can be solved. Namely, these problems are related to heat,mass, and the manufacturing method.

As apparent from the above-explained descriptions, the above-explainedfeatures owned by such an electric wiring path having the characteristicimpedance disclosed in the present invention will depend upon arelationship between this characteristic impedance and the impedance ofthe recording element of the magnetic head. This relationship may beextended to another relationship between a read element 22 of a magnetichead (see FIG. 7) having a different impedance characteristic and theelectric wiring, which may be readily understood by any person who isskilled in the electric field.

The read element 22 is constructed of an electrode 19, and a thin-filmmagneto resistive device 23. This electrode 19 supplies a current tothis thin-film magneto resistive device 23, and further detects a changein resistance values. This read element 22 is wrapped by metal shields25 and 28 (see FIG. 7). Because of this shielding influence, there aremany cases that the reading element owns the capacitive characteristic,as compared with the recording element. As a result, it is required tomade the electric wiring having the capacitive characteristic in orderto match the impedance of the electric wiring with the impedance of thereading element so as to realize the high frequency recording operation.In FIG. 7, reference numeral 20 shows a substrate of a magnetic head,reference numeral 21 is a write element, reference numeral 24 shows alower layer, reference numeral 26 represents a spiral coil, referencenumeral 27 indicates an upper magnetic pole, and reference numeral 28denotes a lower magnetic pole which may function as a shield duringreading operation.

FIG. 8A illustratively shows another embodiment to which the presentinvention is applied. As indicated in this drawing, an electric wiring 4is arranged by a read wiring 200 (constructed of read wirings 4-3 and4-4), and a write wiring 201 (constructed of write wirings 4-1 and 4-2).Similar to the above-explained embodiment, these read/write wirings200/201 are formed on the suspension 3. These electric wirings 200 and201 are constructed of conductive metals, and are protected by employingan insulating film from other metal parts in order to maintain electricinsulating conditions.

The form of this read wiring 200 is indicated in a sectional viewVIIIC—VIIIC at a lower portion of FIG. 8B. That is, both a circuit widthand a thickness of this read wiring 200 are made different from those ofthe write wiring 201. Concretely speaking, the width of this read wiring200 is selected to be 10 μm, and the thickness thereof is selected to be2.0 μm. Other condition of this read wiring 200 are commonly used to thewrite wiring 201, a thickness of polyimide resin 7-1 is selected to beapproximately 20 μm and a thickness of a protection layer 7-2 isselected to be approximately 10 μm. Also, a film structure of theelectric wiring is Au/Ni/Cu/Cr, and is commonly used to the write wiring(film thicknesses are different from each other).

The purpose of this structure is to make the impedance of the readwiring equal to the impedance of the electric wiring (otherwise, readcircuit is approached to electric wiring). As a consequence, in orderthat the characteristic impedance of the electric wiring is set to becapacitive, which is connected to the read wiring corresponding to thecapacitive element, the width of the electric wiring is widened. Also,since the current supplied to the read wiring is smaller than that ofthe write electric wiring, the film thickness thereof is made thinner.In addition to the method for setting the impedance to be capacitive,the film thickness of the insulating layers interposed among thesuspension 3, the wiring path 4-3, and the wiring path 4-4 may be madethin.

Similarly, a difference between the characteristic impedance of thewrite wiring and the characteristic impedance of the read wiring may berealized by varying any one of the following constants, or by varyingthese constants in a composite manner. These constants are the width ofthe electric wiring, the thickness of the electric wiring, a specificelectric resistance value of the electric wiring, the dielectricconstant and the film thickness of the insulating film made in contactwith this electric wiring, the distance between the electric wirings,and the stacked layer structure of the electric conductive material forconstituting the electric wiring. As a consequence, any of suchembodiments in which these constants are varied may be involved in thetechnical scope of the present invention, while these constantvariations are carried out so as to optimize the characteristicimpedance of the read wiring and also the characteristic impedance ofthe write wiring.

Several concrete examples among these embodiments are indicated in FIG.9A, FIG. 9B, and FIG. 9C. FIG. 9A represents such a concrete examplethat film thicknesses of insulating layers are made thin, and areinterposed among the suspension 3, a read wiring 4-3, and a read wiring4-4. In FIG. 9A, reference numerals 4-1 and 4-2 show write wirings;reference numerals 7-1 and 7-2 indicate polyimide resin layersfunctioning as insulating layers; and symbols W1 and W2 represent aninterval between a pair of these write wiring paths and a intervalbetween a pair of these read wiring paths. Also, symbols T1 and T2 showa film thickness of polyimide resin functioning as an insulating layerpositioned under the write wiring path, and a film thickness ofpolyimide resin functioning as an insulating layer positioned under theread wiring path. A relationship between these film thicknesses is givenas T1>T2. Since such a thickness relationship is employed, the packagingdensity of the electric wirings can be improved. FIG. 9B indicates sucha concrete example that an interval between a pair of read wiring pathsis made smaller than an interval between a pair of write wiring paths. Arelationship between these intervals is given as W1>W2. In this concreteexample, the insulating layer 7-1 can be made with the same thickness,so that the manufacturing process can be made simple. FIG. 9C representssuch a concrete example that a pair of read wiring paths are formedbetween a pair of write wiring paths, and an interval between the pairof these read wiring paths is made narrower than an interval between thepair of these write wiring paths. As apparent from the foregoingdescription, a relationship between these intervals is given as W1>W2.With employment of such a structure, the manufacturing process operationcan be simplified, and furthermore, the package density of theseelectric wirings can be improved.

In accordance with the respective embodiment modes, the respectiverecording system (writing system) and reproducing system (readingsystem) can be realized under optimum matching conditions. As a resultof the effects achieved by this optimum matching condition, the electricsignals can be transferred in the high efficiency as well as the highprecision under high frequency condition. As a consequence, the presentinvention may be applied to high frequency recording operation exceedingthe frequency of 500 MHz in near future.

In the respective embodiments, the electric wiring is constituted by asingle component. As a result., this single component structure issuitable for realizing such that the characteristic impedance of theelectric wiring path is uniformly made. However, the present inventionis not limited to such restrictions, both the electric wiring may beconstituted by employing an electric cable made by connecting aplurality of signal paths. In this alternative case, it is obvious thateach of these plural wiring paths must satisfy any one of theseconditions described in the above-explained embodiments. Furthermore, asa result of our investigation, the difference between thecharacteristics of these wiring paths should be suppressed smaller than10%. If this difference between these characteristic impedances islarge, then reflections newly occur at coupling portions, and thusdesirable rise time “τ” cannot be obtained due to these reflections. Itshould be noted that the restriction of 10% could be established basedupon our experiment results, depending upon condition related to therise time “τ”, a difference of approximately 20% between characteristicimpedances may be expected so as to achieve the effect according to thepresent invention. Therefore, this difference of 20% may be involved inthe technical scope of the present invention.

While the present invention has been described in detail, it is possibleto realize such a magnetic disk apparatus capable of performing the highfrequency recording operation by employing the low-cost structuralcomponents. Also, the high frequency recording operation of the magneticdisk apparatus can be realized without no limitation in the lengths ofthe electric wirings, while the present invention is applied.

1. A constructural member comprising: a magnetic head including a writeelement and a read element, an integrated circuit for executing anelectric signal received from said magnetic head, a pair of writewirings which form an electric conducting path for interconnecting saidwrite element and said integrated circuit, a pair of read wirings whichform an electric conducting path for interconnecting said read elementand said integrated circuit, a suspension for suspending said magnetichead, and an arm for supporting said suspension, wherein an intervalbetween the pair of write wirings is larger than an interval between thepair of read wirings.
 2. A constructural member comprising, according toclaim 1, wherein said pair of read wirings is formed between one writewiring and another write wiring.
 3. A constructural member comprising,according to claim 1, wherein a characteristic impedance of said writewiring is higher than an impedance of said write element within a rangeless than an operation frequency.
 4. A constructural member comprising,according to claim 1, wherein a characteristic impedance of said writewiring is higher than an impedance of said read wiring.
 5. Aconstructural member comprising: a magnetic head including a writeelement and a read element, an integrated circuit for executing anelectric signal received from said magnetic head, at least one electricconducting path for interconnecting said write element and saidintegrated circuit, at least another electric conducting path forinterconnecting said read element and said integrated circuit, asuspension for suspending said magnetic head, and an arm for supportingsaid suspension, wherein a width of said another electric conductingpath is larger than a width of said one electric conducting path.
 6. Aconstructural member comprising, according to claim 5, wherein acharacteristic impedance of said electric conducting path is higher thanan impedance of said write element within a range less than an operationfrequency.
 7. A constructural member comprising, according to claim 5,wherein a characteristic impedance of said one electric conducting pathis higher than an impedance of said another electric conducting path. 8.A constructural member comprising: a magnetic head including a writeelement and a read element, an integrated circuit for executing anelectric signal received from said magnetic head, at least one electricconducting path for interconnecting said write element and saidintegrated circuit, at least another electric conducting path forinterconnecting said read element and said integrated circuit, asuspension for suspending said magnetic head, and an arm for supportingsaid suspension, an insulating layer formed between said suspension andsaid electric conducting path, wherein a thickness of said insulatinglayer positioned under said one electric conducting path is larger thana thickness of said insulating layer positioned under said anotherelectric conducting path.
 9. A constructural member comprising,according to claim 8, wherein a characteristic impedance of said oneelectric conducting path is higher than an impedance of said writeelement within a range less than an operation frequency.
 10. Aconstructural member comprising, according to claim 8, wherein acharacteristic impedance of said one electric conducting path is higherthan an impedance of said another electric conducting path.